Mfg Part Number: 205-0059-001
Alternate P/N: 2050059001
NSN : 5962-01-356-6553
NIIN : 013566553
CAGE Code : 66847
Manufacturer: Dpac Technologies Corp
Item Name : Microcircuit Assembly
If you’re in need of NSN parts, Purchasing Synergy is the ultimate source. As an ASAP Semiconductor company, we have access to a vast and diverse inventory of parts and components like 205-0059-001 for the aerospace, civil aviation, defense, electronics, and industrial markets. This includes parts such as Microcircuit Assembly from Dpac Technologies Corp with Cage Code 66847 as well as part numbers like 205-0059-001 and FSC 5962 Microcircuits Electronic with013566553. Purchasing Synergy has more than two billion new and obsolete parts readily available with short lead times and competitive prices and, as we are an AS9120B, ISO 9001:2015, and FAA AC 00-56B accredited business, and the only independent distributor with a No China Sourcing Pledge, each part we sell is fully traceable or comes directly from the manufacturer.
Our website offers a range of parametric search capabilities which allow our customers to search for parts through a number like 205-0059-001 and filters, one of which is National Stock Number, or NSN. A National Stock Number is an identifier applied to any item of supply that is repeatedly procured, stocked, stored, issued, and used throughout the federal supply system. Purchasing Synergy has a broad selection of NSN parts such as 5962013566553 from manufacturers like Dpac Technologies Corp. To begin the purchasing process immediately, submit an RFQ today.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-356-6553 Item Description: Microcircuit Assembly | 5962 | 013566553 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
205-0059-001 | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.999 INCHES NOMINAL |
ADAT | BODY WIDTH | 0.999 INCHES NOMINAL |
ADAU | BODY HEIGHT | 0.170 INCHES NOMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND RADIATION HARDENED AND STATIC OPERATION |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 4 MEMORY |
FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS CRITICAL ITEMS |
NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 31 PIN |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
CZER | MEMORY DEVICE TYPE | RAM |
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