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Get it fast All inventory ready to ship from our sellersMfg Part Number: MB8464-15CV-W-SC
Alternate P/N: MB846415CVWSC
NSN : 5962-01-421-1336
NIIN : 014211336
CAGE Code : 61271
Manufacturer: Fujitsu Microelectronics Inc
Item Name : Microcircuit Memory
If you’re in need of NSN parts, Purchasing Synergy is the ultimate source. As an ASAP Semiconductor company, we have access to a vast and diverse inventory of parts and components like MB8464-15CV-W-SC for the aerospace, civil aviation, defense, electronics, and industrial markets. This includes parts such as Microcircuit Memory from Fujitsu Microelectronics Inc with Cage Code 61271 as well as part numbers like MB8464-15CV-W-SC and FSC 5962 Microcircuits Electronic with014211336. Purchasing Synergy has more than two billion new and obsolete parts readily available with short lead times and competitive prices and, as we are an AS9120B, ISO 9001:2015, and FAA AC 00-56B accredited business, and the only independent distributor with a No China Sourcing Pledge, each part we sell is fully traceable or comes directly from the manufacturer.
Our website offers a range of parametric search capabilities which allow our customers to search for parts through a number like MB8464-15CV-W-SC and filters, one of which is National Stock Number, or NSN. A National Stock Number is an identifier applied to any item of supply that is repeatedly procured, stocked, stored, issued, and used throughout the federal supply system. Purchasing Synergy has a broad selection of NSN parts such as 5962014211336 from manufacturers like Fujitsu Microelectronics Inc. To begin the purchasing process immediately, submit an RFQ today.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-421-1336 Item Description: Microcircuit Memory | 5962 | 014211336 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Mb8464-15cv-W-Sc | 5 | 1 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| NHCF | Nuclear Hardness Critical Feature | HARDENED |
| CZEQ | Time Rating Per Chacteristic | 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 150.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| MRC | Decoded Requirement | Clear Text Reply |
| AEHX | Maximum Power Dissipation Rating | 495.0 MILLIWATTS |
| CQSJ | Inclosure Material | CERAMIC |
| TTQY | Terminal Type And Quantity | 32 LEADLESS |
| CBBL | Features Provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND MONOLITHIC AND 3-STATE OUTPUT AND LOW POWER |
| CWSG | Terminal Surface Treatment | SOLDER |
| CQSZ | Inclosure Configuration | LEADED CHIP CARRIER |
| AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZER | Memory Device Type | RAM |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
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