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Get it fast All inventory ready to ship from our sellersMfg Part Number: 7567652-002
Alternate P/N: 7567652002
NSN : 5962-01-245-3441
NIIN : 012453441
CAGE Code : 13160
Manufacturer: General Dynamics Land Systems Inc
Item Name : Microcircuit Memory
If you’re in need of NSN parts, Purchasing Synergy is the ultimate source. As an ASAP Semiconductor company, we have access to a vast and diverse inventory of parts and components like 7567652-002 for the aerospace, civil aviation, defense, electronics, and industrial markets. This includes parts such as Microcircuit Memory from General Dynamics Land Systems Inc with Cage Code 13160 as well as part numbers like 7567652-002 and FSC 5962 Microcircuits Electronic with012453441. Purchasing Synergy has more than two billion new and obsolete parts readily available with short lead times and competitive prices and, as we are an AS9120B, ISO 9001:2015, and FAA AC 00-56B accredited business, and the only independent distributor with a No China Sourcing Pledge, each part we sell is fully traceable or comes directly from the manufacturer.
Our website offers a range of parametric search capabilities which allow our customers to search for parts through a number like 7567652-002 and filters, one of which is National Stock Number, or NSN. A National Stock Number is an identifier applied to any item of supply that is repeatedly procured, stocked, stored, issued, and used throughout the federal supply system. Purchasing Synergy has a broad selection of NSN parts such as 5962012453441 from manufacturers like General Dynamics Land Systems Inc. To begin the purchasing process immediately, submit an RFQ today.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-245-3441 Item Description: Microcircuit Memory | 5962 | 012453441 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 7567652-002 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| CZEQ | Time Rating Per Chacteristic | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CZER | Memory Device Type | RAM |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CQZP | Input Circuit Pattern | 19 INPUT |
| CBBL | Features Provided | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN AND HIGH RELIABILITY AND W/ENABLE |
| CQSJ | Inclosure Material | CERAMIC |
| ADAT | Body Width | 0.310 INCHES MAXIMUM |
| TTQY | Terminal Type And Quantity | 22 PRINTED CIRCUIT |
| CWSG | Terminal Surface Treatment | SOLDER |
| ADAQ | Body Length | 1.111 INCHES MAXIMUM |
| AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
| ADAU | Body Height | 0.180 INCHES MAXIMUM |
| TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| MRC | Decoded Requirement | Clear Text Reply |
| CQSZ | Inclosure Configuration | DUAL-IN-LINE |
| AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZZZ | Memory Capacity | UNKNOWN |
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