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Get it fast All inventory ready to ship from our sellersMfg Part Number: PAL16R4BMW 883B
Alternate P/N: PAL16R4BMW883B
NSN : 5962-01-336-5571
NIIN : 013365571
CAGE Code : 50364
Manufacturer: Mmi Amd
Item Name : Microcircuit Memory
If you’re in need of NSN parts, Purchasing Synergy is the ultimate source. As an ASAP Semiconductor company, we have access to a vast and diverse inventory of parts and components like PAL16R4BMW 883B for the aerospace, civil aviation, defense, electronics, and industrial markets. This includes parts such as Microcircuit Memory from Mmi Amd with Cage Code 50364 as well as part numbers like PAL16R4BMW 883B and FSC 5962 Microcircuits Electronic with013365571. Purchasing Synergy has more than two billion new and obsolete parts readily available with short lead times and competitive prices and, as we are an AS9120B, ISO 9001:2015, and FAA AC 00-56B accredited business, and the only independent distributor with a No China Sourcing Pledge, each part we sell is fully traceable or comes directly from the manufacturer.
Our website offers a range of parametric search capabilities which allow our customers to search for parts through a number like PAL16R4BMW 883B and filters, one of which is National Stock Number, or NSN. A National Stock Number is an identifier applied to any item of supply that is repeatedly procured, stocked, stored, issued, and used throughout the federal supply system. Purchasing Synergy has a broad selection of NSN parts such as 5962013365571 from manufacturers like Mmi Amd. To begin the purchasing process immediately, submit an RFQ today.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-336-5571 Item Description: Microcircuit Memory | 5962 | 013365571 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Pal16r4bmw 883b | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.300 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.100 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.1 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND PROGRAMMABLE AND BIPOLAR |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PAL |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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