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Get it fast All inventory ready to ship from our sellersMfg Part Number: LSM3L
NSN : 5961-01-042-3338
NIIN : 010423338
CAGE Code : 28564
Manufacturer: Refac Electronics Corp
Item Name : Semiconductor Device Photo
If you’re in need of NSN parts, Purchasing Synergy is the ultimate source. As an ASAP Semiconductor company, we have access to a vast and diverse inventory of parts and components like LSM3L for the aerospace, civil aviation, defense, electronics, and industrial markets. This includes parts such as Semiconductor Device Photo from Refac Electronics Corp with Cage Code 28564 as well as part numbers like LSM3L and FSC 5961 Semiconductor Devices and Associated Hardware with010423338. Purchasing Synergy has more than two billion new and obsolete parts readily available with short lead times and competitive prices and, as we are an AS9120B, ISO 9001:2015, and FAA AC 00-56B accredited business, and the only independent distributor with a No China Sourcing Pledge, each part we sell is fully traceable or comes directly from the manufacturer.
Our website offers a range of parametric search capabilities which allow our customers to search for parts through a number like LSM3L and filters, one of which is National Stock Number, or NSN. A National Stock Number is an identifier applied to any item of supply that is repeatedly procured, stocked, stored, issued, and used throughout the federal supply system. Purchasing Synergy has a broad selection of NSN parts such as 5961010423338 from manufacturers like Refac Electronics Corp. To begin the purchasing process immediately, submit an RFQ today.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-042-3338 Item Description: Semiconductor Device Photo | 5961 | 010423338 | 0 | N | A | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | U | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Lsm3l | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | PLASTIC |
| AXGY | MOUNTING METHOD | TERMINAL |
| CTMZ | SEMICONDUCTOR MATERIAL | GALLIUM ARSENIDE PHOSPHIDE |
| FEAT | SPECIAL FEATURES | MOUNTED IN A RED DIFFUSED PLASTICPACKAGE |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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