Mfg Part Number: TD81256
NSN : 5961-00-328-2385
NIIN : 003282385
CAGE Code : 15818
Manufacturer: Telcom Semiconductor Inc
Item Name : Semiconductor Device Diode
If you’re in need of NSN parts, Purchasing Synergy is the ultimate source. As an ASAP Semiconductor company, we have access to a vast and diverse inventory of parts and components like TD81256 for the aerospace, civil aviation, defense, electronics, and industrial markets. This includes parts such as Semiconductor Device Diode from Telcom Semiconductor Inc with Cage Code 15818 as well as part numbers like TD81256 and FSC 5961 Semiconductor Devices and Associated Hardware with003282385. Purchasing Synergy has more than two billion new and obsolete parts readily available with short lead times and competitive prices and, as we are an AS9120B, ISO 9001:2015, and FAA AC 00-56B accredited business, and the only independent distributor with a No China Sourcing Pledge, each part we sell is fully traceable or comes directly from the manufacturer.
Our website offers a range of parametric search capabilities which allow our customers to search for parts through a number like TD81256 and filters, one of which is National Stock Number, or NSN. A National Stock Number is an identifier applied to any item of supply that is repeatedly procured, stocked, stored, issued, and used throughout the federal supply system. Purchasing Synergy has a broad selection of NSN parts such as 5961003282385 from manufacturers like Telcom Semiconductor Inc. To begin the purchasing process immediately, submit an RFQ today.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-00-328-2385 Item Description: Semiconductor Device Diode | 5961 | 003282385 | 0 | N | ||
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | U | |||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Td81256 | 2 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 0.200 INCHES MAXIMUM |
ADAV | OVERALL DIAMETER | 0.080 INCHES MAXIMUM |
AXGY | MOUNTING METHOD | TERMINAL |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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